Sputtering Targets
Semiconductor Grade Thin-Film Sputtering Targets
Tailored for advanced PVD applications, we offer high-performance sputtering targets in various metals and custom alloys, such as Al, Ti, NiV, Cu, and CuMn. These materials are essential for interconnect metallization and advanced packaging in semiconductor fabrication.With ultra-high relative density, homogeneous microstructures, and extreme surface purity, our targets are engineered to drastically reduce particle flaking during sputtering—maximizing deposition performance and wafer yields for our clients.
Specification (Semiconductor Industry Standards)
- Material : Cu, CuMn, Al, Ti, NiV
- Purity : 3N5 ~ 6N (varies by material)
- Relative Density : ≥ 99.5%
- Surface Treatment : Ra < 0.4µm, vacuum packaging